通富微電測試技術(shù)

Production Overview

        TFME offers various WBBGA and WBLGA package based on customer different requirement.

Features
- 1.1x0.7 mm to 21x21 mm Package
- 0.2mm to 1.0mm C Mold Chase
- 01005 Components SMT
- 0.3x0.3 mm Small Die 
- 1-6 Layer Substrate

Process Capability & Design Rule

Reliability Test Standards

Shipment Packing